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6 Document Number: 318080-002
6-8 Conceptual Fan Control Diagram For a PECI-Based Platform ..................................108
7-1 Stop Clock State Machine..................................................................................114
7-2 Logical Schematic of SMBus Circuitry..................................................................117
Tables
1-1 Quad-Core Intel® Xeon® Processor 7300 Series Processor Features ........................10
1-2 Dual-Core Intel® Xeon® Processor 7200 Series Processor Features .........................10
2-1 Core Frequency to FSB Multiplier Configuration......................................................17
2-2 BSEL[2:0] Frequency Table.................................................................................17
2-3 Voltage Identification Definition ...........................................................................19
2-4 FSB Signal Groups .............................................................................................21
2-5 AGTL+ Signal Description Table...........................................................................22
2-6 Non AGTL+ Signal Description Table.....................................................................22
2-7 Signal Reference Voltages...................................................................................22
2-8 Processor Absolute Maximum Ratings...................................................................23
2-9 Voltage and Current Specifications.......................................................................25
2-10 VCC Static and Transient Tolerance......................................................................30
2-11 AGTL+ Signal Group DC Specifications..................................................................34
2-12 CMOS Signal Input/Output Group DC Specifications................................................35
2-13 Open Drain Signal Group DC Specifications ...........................................................35
2-14 SMBus Signal Group DC Specifications..................................................................35
2-15 PECI DC Electrical Limits.....................................................................................36
2-16 VCC Overshoot Specifications..............................................................................37
2-17 AGTL+ Bus Voltage Definitions ............................................................................39
2-18 FSB Differential BCLK Specifications .....................................................................39
2-19 Front Side Bus Differential Clock AC Specifications .................................................40
2-20 Front Side Bus Common Clock AC Specifications ....................................................40
2-21 FSB Source Synchronous AC Specifications............................................................41
2-22 Miscellaneous GTL+ AC Specifications...................................................................42
2-23 Front Side Bus AC Specifications (Reset Conditions) ...............................................42
2-24 TAP Signal Group AC Specifications ......................................................................42
2-25 VID Signal Group AC Specifications ......................................................................44
2-26 SMBus Signal Group AC Specifications..................................................................44
3-1 Processor Loading Specifications..........................................................................66
3-2 Package Handling Guidelines...............................................................................67
3-3 Processor Materials............................................................................................67
4-1 Pin Listing by Pin Name ......................................................................................71
4-2 Pin Listing by Pin Number ...................................................................................79
5-1 Signal Definitions...............................................................................................87
6-1 Quad-Core Intel® Xeon® E7300 Processor Thermal Specifications...........................96
6-2 Quad-Core Intel® Xeon® E7300 Processor Thermal Profile Table.............................97
6-3 Quad-Core Intel® Xeon® X7350 Processor Thermal Specifications...........................98
6-4 Quad-Core Intel® Xeon® X7350 Processor Thermal Profile Table.............................99
6-5 Quad-Core Intel® Xeon® L7345 Processor Thermal Specifications ...........................99
6-6 Quad-Core Intel® Xeon® L7345 Processor Thermal Profile....................................100
6-7 Dual-Core Intel® Xeon® Processor 7200 Series Thermal Specifications ..................101
6-8 Dual-Core Intel® Xeon® Processor 7200 Series Thermal Profile.............................102
6-9 BREQ# signal assertion during power on.............................................................109
6-10 PECI Address assigned to processor ...................................................................109
6-11 GetTemp0() and GetTemp1() Error Codes...........................................................110
7-1 Power-On Configuration Option pins...................................................................111
- Processor 7200 Series 1
- Contents 3
- 4 Document Number: 318080-002 4
- Document Number: 318080-002 5 5
- 6 Document Number: 318080-002 6
- Document Number: 318080-002 7 7
- Revision History 8
- 1 Introduction 9
- 1.1 Terminology 11
- Introduction 12
- 1.2 State of Data 13
- 1.3 References 13
- 2 Electrical Specifications 15
- Clocking 16
- 2.3.2 PLL Power Supply 17
- Electrical Specifications 18
- Table 2-4. FSB Signal Groups 21
- Asynchronous Signals 22
- 2.9 Mixing Processors 23
- CC_VTT_OUT 27
- Time Duration (s) 28
- Sustained Current (A) 28
- Table 2-10. V 30
- Load Lines 32
- Static and Transient 34
- Tolerance Load Lines 34
- Specifications 35
- 2.11.2.1 DC Characteristics 36
- 2.11.3 V 37
- Overshoot Specification 37
- Example Overshoot Waveform 38
- Tp = T1: BCLK[1:0] period 47
- THERMTRIP# 51
- Figure 2-26. VID Step Timings 54
- 3 Mechanical Specifications 57
- Mechanical Specifications 58
- 3.7 Processor Materials 67
- 3.8 Processor Markings 68
- Processor 69
- 4 Pin Listing 71
- 10 of 16) 75
- 11 of 16) 76
- 12 of 16) 76
- 13 of 16) 77
- 14 of 16) 77
- 15 of 16) 78
- 16 of 16) 78
- 1 of 14) 79
- 2 of 14) 79
- 3 of 14) 80
- 4 of 14) 80
- 5 of 14) 81
- 6 of 14) 81
- 8 of 14) 82
- 7 of 14) 82
- 9 of 14) 83
- 10 of 14) 83
- 11 of 14) 84
- 12 of 14) 84
- 13 of 14) 85
- 14 of 14) 85
- Pin Listing 86
- 5 Signal Definitions 87
- CC and BCLK have reached 92
- 6 Thermal Specifications 95
- CASE_MAX 96
- Thermal Profile 98
- = 0.162 x Power + 45 98
- Pow er (W) 100
- Temperature (C) 100
- = 0.420 x Power + 45 100
- = 0.238 x Power + 45 101
- 6.1.2 Thermal Metrology 102
- 6.2.2 Thermal Monitor 103
- 6.2.3 Thermal Monitor 2 104
- 6.2.4 On-Demand Mode 105
- 6.2.5 PROCHOT# Signal 106
- 6.2.6 FORCEPR# Signal 106
- 6.2.7 THERMTRIP# Signal 106
- 6.3.1 Introduction 107
- 6.3.2 PECI Specifications 108
- 7 Features 111
- 7.2.1 Normal State 112
- EXTENDED_HALT 113
- 7.2.3 Stop-Grant State 114
- 7.3 Enhanced Intel SpeedStep 115
- Technology 115
- Features 116
- 7.4.1 SMBus Device Addressing 117
- Transactions 118
- 7.4.3.1 Header 121
- 7.4.3.2 Processor Data 125
- 7.4.3.3 Processor Core Data 126
- 16h-19h 127
- 1Ah-1Bh 127
- Offset: 1Ch 128
- 1Dh-1Eh 128
- 1Fh-20h 128
- 7.4.3.4 Cache Data 129
- 7.4.3.5 Package Data 131
- 7.4.3.6 Part Number Data 132
- 38h-3Eh 133
- 3Fh-4Ch 133
- 4Dh=54h 133
- 55h-6Eh 134
- 71h-72h 134
- 7.4.3.8 Feature Data 135
- 7.4.3.9 Other Data 136
- 7.4.4 Checksums 137
- 7.4.5 Scratch EEPROM 137
- 8.1 Introduction 139
- 8.2 Thermal Specifications 139
- 9 Debug Tools Specifications 141
- Debug Tools Specifications 142
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